
HUBER+SUHNER Unveils High-Performance VITA 67.3 RF Interconnect Portfolio for Demanding Applications
Zurich, Switzerland – July 9, 2025 – HUBER+SUHNER, a global leader in components and systems for electrical and optical energy and data transmission, today announced the launch of its innovative VITA 67.3 RF interconnect portfolio. This new offering is specifically designed to address the stringent requirements of high-density, high-performance applications where space is at a premium, particularly within the telecommunications sector and defense industries.
The VITA 67.3 standard, a key advancement in RF interconnect technology, enables the integration of coaxial and twin-axial RF interconnects into the VITA 65/OpenVPX backplane architecture. HUBER+SUHNER’s new portfolio leverages this standard to deliver exceptional signal integrity, superior performance, and reliable connectivity in even the most challenging environments.
“We are thrilled to introduce our VITA 67.3 RF interconnect portfolio, a testament to our commitment to providing cutting-edge solutions for the evolving needs of our customers,” said [Insert Name and Title of a relevant HUBER+SUHNER representative, e.g., Urs Hugentobler, Head of Product Management RF Interconnects at HUBER+SUHNER]. “The demand for miniaturization and increased functionality in electronic systems continues to grow. Our VITA 67.3 solution empowers engineers to achieve greater density and performance without compromising on signal quality or reliability, making it an ideal choice for next-generation communication systems and advanced defense platforms.”
The HUBER+SUHNER VITA 67.3 portfolio is engineered to deliver outstanding RF performance across a wide range of frequencies, ensuring minimal signal loss and excellent impedance matching. Key features and benefits of this new product line include:
- High-Density Connectivity: The VITA 67.3 standard facilitates the integration of multiple RF connections within a compact footprint, enabling greater port density on backplanes and system boards. This is crucial for telecommunications equipment, such as base stations and routing devices, where space optimization is paramount.
- Exceptional Signal Integrity: The interconnects are designed with meticulous attention to detail to maintain superior signal integrity, even at high frequencies. This translates to clearer signals, reduced noise, and improved overall system performance.
- Robust and Reliable Design: Built to withstand harsh operating conditions, the VITA 67.3 portfolio offers robust mechanical and environmental resistance. This ensures dependable operation in demanding sectors like aerospace, defense, and industrial applications.
- Ease of Integration: The modular nature of the VITA 67.3 standard, combined with HUBER+SUHNER’s expertise in connector design, simplifies the integration process for system developers, reducing development time and costs.
- Versatile Solutions: The portfolio is expected to encompass a range of configurations and connector types to suit diverse application needs, providing flexibility for various system architectures.
The launch of HUBER+SUHNER’s VITA 67.3 RF interconnect portfolio marks a significant advancement in the field of high-performance interconnect solutions. By addressing the critical need for compact, reliable, and high-performing RF connectivity, the company is well-positioned to support the development of next-generation technologies across various industries. This innovative offering underscores HUBER+SUHNER’s dedication to pushing the boundaries of RF technology and providing its customers with the tools they need to succeed in an increasingly complex and interconnected world.
About HUBER+SUHNER:
HUBER+SUHNER is a global company with a long tradition of developing and producing high-quality components and systems for electrical and optical energy and data transmission. With its broad portfolio, extensive market knowledge, and strong customer focus, the company provides solutions for various industries, including telecommunications, industry, automotive, and aerospace.
Contact: [Insert PR Contact Information for HUBER+SUHNER]
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PR Newswire Telecommunications published ‘Excellence in tight spaces: HUBER+SUHNER launches high performance VITA 67.3 RF interconnect portfolio’ at 2025-07-09 07:00. Please write a detailed article about this news in a polite tone with relevant information. Please reply in English with the article only.