SK hynix’s Key Foundry and LB Semicon Forge Ahead in Advanced Semiconductor Packaging with Direct RDL Development
Seoul, South Korea – July 15, 2025 – In a significant stride towards enhancing the capabilities of high-performance semiconductors, particularly for the demanding automotive sector, SK hynix’s foundry arm, SK Keyfoundry, has announced a collaborative development of Direct Redistribution Layer (RDL) technology with LB Semicon. This partnership is poised to revolutionize semiconductor packaging, offering improved performance, reduced form factors, and greater cost-effectiveness for next-generation automotive chips.
The announcement, made today by PR Newswire, highlights a strategic move by both companies to address the escalating complexities and performance requirements of modern automotive semiconductors. As vehicles become increasingly sophisticated, incorporating advanced driver-assistance systems (ADAS), artificial intelligence, and enhanced connectivity, the need for more efficient and powerful semiconductor solutions is paramount. Advanced packaging techniques are at the forefront of achieving these goals, and Direct RDL technology represents a pivotal advancement in this domain.
Traditional RDL processes often involve multiple steps, which can lead to increased manufacturing time, higher costs, and potential performance limitations. Direct RDL technology, as developed by SK Keyfoundry and LB Semicon, aims to streamline this process by enabling the direct creation of the RDL on the wafer level. This integrated approach is expected to yield several key benefits:
- Enhanced Electrical Performance: By minimizing the distance and number of interfaces, Direct RDL technology can significantly improve signal integrity and reduce signal loss, leading to faster and more reliable performance for high-speed data processing and communication within vehicles.
- Miniaturization and Thinner Packaging: The ability to form the RDL directly on the wafer can contribute to more compact and thinner semiconductor packages. This is crucial for automotive applications where space is often at a premium, allowing for greater design flexibility and integration.
- Improved Thermal Management: More efficient electrical pathways can also lead to better heat dissipation, a critical factor for automotive components operating under demanding conditions. Improved thermal management contributes to enhanced reliability and extended product lifespan.
- Cost Optimization: By simplifying the manufacturing flow and reducing the number of processing steps, Direct RDL technology has the potential to lower overall production costs, making advanced semiconductor solutions more accessible for the automotive industry.
The collaboration between SK Keyfoundry, a growing player in the foundry market with a strong focus on advanced technologies, and LB Semicon, a specialist in semiconductor packaging solutions, leverages the complementary strengths of each organization. SK Keyfoundry’s expertise in wafer manufacturing and process development, coupled with LB Semicon’s in-depth knowledge of packaging technologies, creates a synergistic approach to bringing this innovative solution to market.
This joint development is particularly significant for the automotive semiconductor market, which demands stringent reliability, high performance, and robust quality. By enabling more efficient packaging for processors, sensors, and communication chips, SK Keyfoundry and LB Semicon are well-positioned to support the automotive industry’s transition towards increasingly autonomous, connected, and electric vehicles.
The companies are expected to further refine and validate this Direct RDL technology in the coming months, with the aim of offering it as a core capability in their advanced packaging portfolios. This initiative underscores SK Keyfoundry’s commitment to innovation and its strategic focus on emerging high-growth markets like automotive, further solidifying its competitiveness in the global semiconductor landscape.
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www.prnewswire.com published ‘SK keyfoundry, in Collaboration with LB Semicon, Co-Develops Direct RDL to Advance Semiconductor Packaging and Strengthen Competitiveness in Automotive High-Performance Semiconductors’ at 2025-07-15 11:00. Please write a detailed article about this news in a polite tone with relevant information. Please reply in English with the article only.