Siemens Unveils AI-Powered Design Transformation Across Chip and PCB Portfolios
Munich, Germany – June 30, 2025 – Siemens Digital Industries Software today announced a significant advancement in electronic design automation (EDA) with the strategic application of artificial intelligence (AI) across its comprehensive chip and printed circuit board (PCB) design portfolios. This pivotal move signals a new era of enhanced efficiency, accelerated innovation, and improved design outcomes for engineers worldwide.
The integration of AI, a technology rapidly reshaping numerous industries, into Siemens’ industry-leading tools marks a proactive approach to address the escalating complexity and performance demands of modern electronic systems. From the intricate details of semiconductor design to the broader architecture of PCBs, AI is being leveraged to automate traditionally time-consuming tasks, optimize critical parameters, and uncover novel design possibilities.
Within its renowned Mentor Graphics portfolio for semiconductor design, Siemens is deploying AI to streamline critical workflows. This includes advancements in areas such as:
- Placement and Routing Optimization: AI algorithms are being trained to analyze vast design datasets and learn optimal placement strategies for transistors and routing paths, leading to significant improvements in chip performance, power consumption, and area (PPA). This intelligent automation can drastically reduce the manual effort required by engineers to achieve optimal results.
- Design Verification and Debugging: AI’s pattern recognition capabilities are being harnessed to identify potential design flaws and bugs much earlier in the verification process. This proactive approach minimizes costly re-spins and accelerates the time-to-market for complex integrated circuits.
- Analog and Mixed-Signal Design: AI is assisting in the optimization of sensitive analog circuits, which often require intricate tuning. By learning from successful design patterns and simulation outcomes, AI can suggest optimal component values and configurations, improving design robustness and performance.
Complementing these advancements in chip design, Siemens is also extending its AI-driven innovation to its Xpedition and PADS PCB design solutions. The company is focusing on:
- Automated Component Placement and Routing: AI-powered tools are now capable of intelligently suggesting component placements and generating complex routing solutions, taking into account factors like signal integrity, thermal management, and manufacturability. This allows designers to focus on higher-level system architecture and critical design decisions.
- Design Rule Checking (DRC) and Constraint Management: AI is enhancing the efficiency and accuracy of DRC, identifying design rule violations that might be missed by traditional rule-based checks. This intelligent application of rules ensures greater design integrity and reduces the potential for manufacturing issues.
- Signal Integrity and Power Integrity Analysis: AI is contributing to more sophisticated analysis of signal and power integrity, predicting and mitigating potential issues before they arise in the physical board. This leads to more reliable and higher-performing electronic products.
“The relentless pace of innovation in electronics demands that we continuously push the boundaries of design technology,” stated a spokesperson for Siemens Digital Industries Software. “By embedding AI across our chip and PCB design portfolios, we are empowering our customers with intelligent tools that not only accelerate their design cycles but also unlock new levels of performance and efficiency. This commitment to AI integration reflects our dedication to providing the most advanced solutions for the challenges of today and tomorrow.”
This strategic application of AI across Siemens’ EDA offerings is expected to provide significant benefits to a wide range of industries, including automotive, aerospace, telecommunications, and consumer electronics, where the demand for increasingly sophisticated and compact electronic solutions continues to grow. The company’s proactive investment in AI underscores its leadership in the EDA market and its commitment to fostering a more innovative and efficient future for electronic design.
Siemens applies AI across chip and PCB design portfolio
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Electronics Weekly published ‘Siemens applies AI across chip and PCB design portfolio’ at 2025-06-30 08:27. Please write a detailed article about this news in a polite tone with relevant information. Please reply in English with the article only.